Part Details for LPC11A13FHI33/201 by NXP Semiconductors
Overview of LPC11A13FHI33/201 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for LPC11A13FHI33/201
| Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock | 2940 |
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RFQ |
Part Details for LPC11A13FHI33/201
LPC11A13FHI33/201 CAD Models
LPC11A13FHI33/201 Part Data Attributes:
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LPC11A13FHI33/201
NXP Semiconductors
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LPC11A13FHI33/201
NXP Semiconductors
IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC32, 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, HVQFN-32, Microcontroller
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFN | |
| Package Description | HVQCCN, LCC32,.27SQ,25 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Additional Feature | SEATED HGT-NOM | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | CORTEX-M0 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQCC-N32 | |
| Length | 5 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 28 | |
| Number of Terminals | 33 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC32,.27SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 6144 | |
| ROM (words) | 24576 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 0.85 mm | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |