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Part Details for LPC1769FBD100 by NXP Semiconductors
Overview of LPC1769FBD100 by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Education and Research
Internet of Things (IoT)
Smart Cities
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Price & Stock for LPC1769FBD100
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 54270 |
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RFQ | ||
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Chip1Cloud | LPC17xx User manual | 10000 |
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RFQ | |
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Sense Electronic Company Limited | LQFP100 | 46 |
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RFQ | |
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Win Source Electronics | LPC17xx User manual | 44444 |
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$8.9860 / $11.3050 | Buy Now |
Part Details for LPC1769FBD100
LPC1769FBD100 CAD Models
LPC1769FBD100 Part Data Attributes:
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LPC1769FBD100
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC1769FBD100
NXP Semiconductors
32-BIT, FLASH, 120MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-407-1, MS-026, LQFP-100
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFP | |
| Package Description | LQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | CORTEX-M3 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e3 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 70 | |
| Number of Terminals | 100 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 65536 | |
| ROM (words) | 524288 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 120 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |