Part Details for LPC54605J512ET180E by NXP Semiconductors
Overview of LPC54605J512ET180E by NXP Semiconductors
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Applications
Healthcare
Telecommunications
Price & Stock for LPC54605J512ET180E
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
568-13365-ND
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DigiKey | IC MCU 32BIT 512KB FLSH 180TFBGA Lead time: 13 Weeks Container: Tray | Limited Supply - Call |
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Buy Now | |
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Future Electronics | LPC54xx Series 512 KB Flash 200 KB RAM 180 MHz 32-Bit Microcontroller -TFBGA-180 RoHS: Compliant pbFree: Yes Min Qty: 189 Package Multiple: 189 Container: Tray | 0Tray |
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$6.0200 / $6.0900 | Buy Now |
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DISTI #
LPC54605J512ET180E
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TME | IC: ARM microcontroller, 24kBSRAM,512kBFLASH, TFBGA180 Min Qty: 1 | 0 |
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$5.0700 / $6.8300 | RFQ |
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Flip Electronics | Stock | 83 |
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RFQ |
Part Details for LPC54605J512ET180E
LPC54605J512ET180E CAD Models
LPC54605J512ET180E Part Data Attributes
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LPC54605J512ET180E
NXP Semiconductors
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Datasheet
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LPC54605J512ET180E
NXP Semiconductors
LPC54S60x/LPC5460x - 32-bit ARM Cortex-M4 microcontroller; up to 512 KB flash and 200 kB SRAM; High-speed USB device/host + PHY; Full-speed USB device/host; Ethernet AVB; LCD; EMC; SPIFI; CAN FD, SDIO; AES; SHA; 12-bit 5 Msamples/s ADC; DMIC subsystem BGA 180-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | TFBGA, | |
| Pin Count | 180 | |
| Manufacturer Package Code | SOT570-3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Date Of Intro | 2018-04-26 | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | 21 | |
| Bit Size | 32 | |
| CPU Family | CORTEX-M4 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PBGA-B180 | |
| Length | 12 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 145 | |
| Number of Terminals | 180 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (bytes) | 204800 | |
| ROM (words) | 524288 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.2 mm | |
| Speed | 180 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |