Part Details for LPC812M101FDH16FP by NXP Semiconductors
Overview of LPC812M101FDH16FP by NXP Semiconductors
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- Number of Functional Equivalents:
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Price & Stock for LPC812M101FDH16FP
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LPC812M101FDH16FP
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Avnet Americas | MCU 32-bit LPC800 ARM Cortex M0+ RISC 16KB Flash 3.3V 16-Pin TSSOP - Rail/Tube (Alt: LPC812M101FDH16FP) RoHS: Compliant Min Qty: 960 Package Multiple: 960 Container: Tube | 0 |
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RFQ | |
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DISTI #
LPC812M101FDH16FP
|
Avnet Americas | MCU 32-bit LPC800 ARM Cortex M0+ RISC 16KB Flash 3.3V 16-Pin TSSOP - Rail/Tube (Alt: LPC812M101FDH16FP) RoHS: Compliant Min Qty: 960 Package Multiple: 960 Container: Tube | 0 |
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RFQ | |
|
DISTI #
LPC812M101FDH16FP
|
Avnet Americas | MCU 32-bit LPC800 ARM Cortex M0+ RISC 16KB Flash 3.3V 16-Pin TSSOP - Rail/Tube (Alt: LPC812M101FDH16FP) RoHS: Compliant Min Qty: 960 Package Multiple: 960 Container: Tube | 0 |
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RFQ | |
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DISTI #
LPC812M101FDH16FP
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EBV Elektronik | MCU 32-bit LPC800 ARM Cortex M0+ RISC 16KB Flash 3.3V 16-Pin TSSOP (Alt: LPC812M101FDH16FP) RoHS: Compliant Min Qty: 96 Package Multiple: 96 Lead time: 3 Weeks, 6 Days | EBV - 0 |
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Part Details for LPC812M101FDH16FP
LPC812M101FDH16FP CAD Models
LPC812M101FDH16FP Part Data Attributes
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LPC812M101FDH16FP
NXP Semiconductors
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Datasheet
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LPC812M101FDH16FP
NXP Semiconductors
LPC812M101FDH16 - 32-bit ARM Cortex-M0+ microcontroller; 16 kB flash and 4 kB SRAM TSSOP 16-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | TSSOP | |
| Package Description | 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16 | |
| Pin Count | 16 | |
| Manufacturer Package Code | SOT403-1 | |
| Reach Compliance Code | compliant | |
| Has ADC | NO | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | CORTEX-M0 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | R-PDSO-G16 | |
| Length | 5 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of I/O Lines | 14 | |
| Number of Terminals | 16 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP16,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 4096 | |
| ROM (words) | 16384 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.1 mm | |
| Speed | 30 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Width | 4.4 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |