Part Details for LS1046AXN8MQA by NXP Semiconductors
Overview of LS1046AXN8MQA by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for LS1046AXN8MQA
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
13AC2715
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Newark | Qoriq Layerscape 4Xa72 64Bit Arm-1.2G Ddr4-1.6G Pcie 1/10Gbe Sata Usb -40-105C 23X23Pkg 0.9V, Tray Multiple Dp Bakeable, Tray Rohs Compliant: Yes |Nxp LS1046AXN8MQA Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$65.8000 / $70.0200 | Buy Now |
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DISTI #
LS1046AXN8MQA
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Avnet Americas | System On Chip Processors, ARM Cortex-A72, 1.2 GHz FCPBGA 780 Pins - Trays (Alt: LS1046AXN8MQA) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
LS1046AXN8MQA
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Avnet Americas | System On Chip Processors, ARM Cortex-A72, 1.2 GHz FCPBGA 780 Pins - Trays (Alt: LS1046AXN8MQA) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
LS1046AXN8MQA
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Avnet Silica | System On Chip Processors, ARM Cortex-A72, 1.2 GHz FCPBGA 780 Pins (Alt: LS1046AXN8MQA) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 7 Weeks, 5 Days | Silica - 0 |
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Buy Now | |
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DISTI #
LS1046AXN8MQA
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EBV Elektronik | System On Chip Processors, ARM Cortex-A72, 1.2 GHz FCPBGA 780 Pins (Alt: LS1046AXN8MQA) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 7 Weeks, 5 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock | 92 |
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RFQ |
Part Details for LS1046AXN8MQA
LS1046AXN8MQA CAD Models
LS1046AXN8MQA Part Data Attributes:
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LS1046AXN8MQA
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LS1046AXN8MQA
NXP Semiconductors
Multifunction Peripheral, CMOS, PBGA780
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | FBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 18 Weeks | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 14 | |
| Boundary Scan | YES | |
| Bus Compatibility | I2C, PCI, SPI, UART, USB | |
| External Data Bus Width | 64 | |
| JESD-30 Code | S-PBGA-B780 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 76 | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 250 | |
| Seated Height-Max | 2.61 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |