Part Details for MAX11259AWX+ by Analog Devices Inc
Overview of MAX11259AWX+ by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Industrial Automation
Healthcare
Medical Imaging
Renewable Energy
Robotics and Drones
Price & Stock for MAX11259AWX+
Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | 24-Bit, 6-Channel, 64ksps, Del Min Qty: 1 Package Multiple: 1 | 1810 |
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Part Details for MAX11259AWX+
MAX11259AWX+ CAD Models
MAX11259AWX+ Part Data Attributes:
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MAX11259AWX+
Analog Devices Inc
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Datasheet
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MAX11259AWX+
Analog Devices Inc
24-Bit, 6-Channel, 16ksps, 6.2nV/√Hz PGA, Delta-Sigma ADC with I<sup>2</sup>C Interface, N/A, 36 Pins, -40 to 125C
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Part Package Code | N/A | |
Pin Count | 36 | |
Manufacturer Package Code | N/A | |
Date Of Intro | 2015-11-10 | |
Samacsys Manufacturer | Analog Devices | |
Analog Input Voltage-Max | 3.6 V | |
Analog Input Voltage-Min | -1.5 V | |
Converter Type | ADC, DELTA-SIGMA | |
JESD-30 Code | S-PBGA-B36 | |
JESD-609 Code | e2 | |
Length | 2.957 mm | |
Linearity Error-Max (EL) | 0.0015% | |
Moisture Sensitivity Level | 1 | |
Number of Analog In Channels | 6 | |
Number of Bits | 24 | |
Number of Functions | 1 | |
Number of Terminals | 36 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Output Bit Code | OFFSET BINARY, 2'S COMPLEMENT BINARY | |
Output Format | SERIAL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA36,6X6,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Sample Rate | 0.016 MHz | |
Seated Height-Max | 0.69 mm | |
Supply Current-Max | 6.2 mA | |
Supply Voltage-Nom | 3.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 2.957 mm |