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Part Details for MAX32625IWYL+T by Analog Devices Inc
Overview of MAX32625IWYL+T by Analog Devices Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Energy and Power Systems
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Consumer Electronics
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Communication and Networking
Robotics and Drones
Price & Stock for MAX32625IWYL+T
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
700-MAX32625IWYL+T
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Mouser Electronics | ARM Microcontrollers - MCU ENTERPRISE LITE ARM M4 32 BIT MICRO RoHS: Compliant | 0 |
|
$5.6500 | Order Now |
|
|
Analog Devices Inc | ENTERPRISE LITE ARM M4 32 BIT Min Qty: 2000 Package Multiple: 1 | 12000 |
|
$4.9000 / $5.6459 | Buy Now |
Part Details for MAX32625IWYL+T
MAX32625IWYL+T CAD Models
MAX32625IWYL+T Part Data Attributes:
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MAX32625IWYL+T
Analog Devices Inc
Buy Now
Datasheet
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MAX32625IWYL+T
Analog Devices Inc
Ultra-Low-Power Arm Cortex-M4 with FPU-Based Microcontroller (MCU) with 512KB Flash and 160KB SRAM, 63-WLCSP-N/A, 63 Pins
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | 63-WLCSP-N/A | |
| Package Description | WLP-63 | |
| Pin Count | 63 | |
| Manufacturer Package Code | 63-WLCSP-N/A | |
| Reach Compliance Code | compliant | |
| Date Of Intro | 2016-10-27 | |
| Samacsys Manufacturer | Analog Devices | |
| Has ADC | YES | |
| Additional Feature | ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Clock Frequency-Max | 0.032 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | R-PBGA-B63 | |
| JESD-609 Code | e2 | |
| Length | 3.868 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of I/O Lines | 40 | |
| Number of Terminals | 63 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (bytes) | 131072 | |
| ROM (words) | 262144 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 0.69 mm | |
| Speed | 96 MHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.2 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 3.068 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |