Part Details for MC68360VR33L by Freescale Semiconductor
Overview of MC68360VR33L by Freescale Semiconductor
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Price & Stock for MC68360VR33L
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 52 |
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RFQ |
Part Details for MC68360VR33L
MC68360VR33L CAD Models
MC68360VR33L Part Data Attributes
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MC68360VR33L
Freescale Semiconductor
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Datasheet
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MC68360VR33L
Freescale Semiconductor
10Mbps, SERIAL COMM CONTROLLER, PBGA357, 1.27 MM PITCH, PLASTIC, BGA-357
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 1.27 MM PITCH, PLASTIC, BGA-357 | |
Pin Count | 357 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO OPERATES AT 5 V SUPPLY | |
Address Bus Width | 32 | |
Boundary Scan | YES | |
Bus Compatibility | 68000 | |
Clock Frequency-Max | 25 MHz | |
Communication Protocol | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | |
Data Encoding/Decoding Method | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | |
Data Transfer Rate-Max | 10 MBps | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B357 | |
JESD-609 Code | e1 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 2 | |
Number of I/O Lines | 46 | |
Number of Serial I/Os | 4 | |
Number of Terminals | 357 | |
On Chip Data RAM Width | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA357,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (words) | 2560 | |
Seated Height-Max | 1.86 mm | |
Supply Current-Max | 250 mA | |
Supply Voltage-Max | 3.3 V | |
Supply Voltage-Min | 2.7 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |