Part Details for MC8610TPX1066JB by NXP Semiconductors
Overview of MC8610TPX1066JB by NXP Semiconductors
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- Number of FFF Equivalents:
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- Number of Functional Equivalents:
- Part Data Attributes
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Applications
Consumer Electronics
Price & Stock for MC8610TPX1066JB
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
MC8610TPX1066JB
|
Direct Components, Inc. | 402 |
|
RFQ | ||
|
Flip Electronics | Stock, ship today | 1746 |
|
$288.6000 | RFQ |
Part Details for MC8610TPX1066JB
MC8610TPX1066JB CAD Models
MC8610TPX1066JB Part Data Attributes
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MC8610TPX1066JB
NXP Semiconductors
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MC8610TPX1066JB
NXP Semiconductors
IC,MICROPROCESSOR,32-BIT,BGA,783PIN,PLASTIC
|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | FCBGA-783 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.1 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 16 | |
Bit Size | 32 | |
Boundary Scan | YES | |
External Data Bus Width | 64 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B783 | |
JESD-609 Code | e0 | |
Length | 29 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 783 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 2.7 mm | |
Speed | 1066 MHz | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 29 mm |