Part Details for MC8640DTHJ1067NE by NXP Semiconductors
Overview of MC8640DTHJ1067NE by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MC8640DTHJ1067NE
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
13AC2839
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Newark | 32-Bit Power Architecture Soc, 2 X 1067Mhz, Ddr1/2, Altivec, Gbe, Pci-E, Srio, -40 To 105C, Rev 3/ Tray Rohs Compliant: Yes |Nxp MC8640DTHJ1067NE Min Qty: 24 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$672.3700 / $713.4400 | Buy Now |
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Rochester Electronics | G8,REV3.0,0.95V,-40/105C RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 7 |
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$699.8500 / $823.3500 | Buy Now |
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Flip Electronics | Stock, ship today | 500 |
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$1,126.2800 | RFQ |
Part Details for MC8640DTHJ1067NE
MC8640DTHJ1067NE CAD Models
MC8640DTHJ1067NE Part Data Attributes
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MC8640DTHJ1067NE
NXP Semiconductors
Buy Now
Datasheet
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MC8640DTHJ1067NE
NXP Semiconductors
RISC Microprocessor, 32-Bit, 1067MHz, CMOS, CBGA1023
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | HBGA, BGA1023,32X32,40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 166.66 MHz | |
| External Data Bus Width | 32 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B1023 | |
| Length | 33 mm | |
| Low Power Mode | NO | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 4 | |
| Number of Terminals | 1023 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA1023,32X32,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 2.97 mm | |
| Speed | 1067 MHz | |
| Supply Voltage-Max | 1 V | |
| Supply Voltage-Min | 0.9 V | |
| Supply Voltage-Nom | 0.95 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 33 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |