Part Details for MC8641VJ1500KE by NXP Semiconductors
Overview of MC8641VJ1500KE by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MC8641VJ1500KE
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MC8641VJ1500KE-954-ND
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DigiKey | 32-BIT POWER ARCHITECTURE SOC, 1 Min Qty: 1 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
26 In Stock |
|
$802.0900 | Buy Now |
|
Rochester Electronics | 32-Bit Power Architecture SoC, 1500MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, 0 to 105C, Rev 3 RoHS: Compliant Status: Obsolete Min Qty: 1 | 26 |
|
$688.3300 / $809.8000 | Buy Now |
DISTI #
4375954
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Farnell | MICROPROCESSORS IC'S RoHS: Compliant Min Qty: 24 Lead time: 3 Weeks, 1 Days Container: Each | 44 |
|
$1,180.0386 | Buy Now |
|
Flip Electronics | Stock | 576 |
|
RFQ |
Part Details for MC8641VJ1500KE
MC8641VJ1500KE CAD Models
MC8641VJ1500KE Part Data Attributes:
|
MC8641VJ1500KE
NXP Semiconductors
Buy Now
|
Compare Parts:
MC8641VJ1500KE
NXP Semiconductors
RISC PROCESSOR
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | FCBGA-1023 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.1 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | NXP | |
Address Bus Width | 16 | |
Bit Size | 32 | |
Boundary Scan | YES | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B1023 | |
JESD-609 Code | e2 | |
Length | 33 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 1023 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | ||
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 2.77 mm | |
Speed | 1500 MHz | |
Supply Voltage-Max | 1.15 V | |
Supply Voltage-Min | 1.05 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver (Sn/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 33 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |