Part Details for MC9328MX21CJMR2 by NXP Semiconductors
Overview of MC9328MX21CJMR2 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MC9328MX21CJMR2
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
57R6182
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Newark | Db I.mx21 17X17 Pb-Fr/ Reel Rohs Compliant: Yes |Nxp MC9328MX21CJMR2 Min Qty: 1000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$25.3100 | Buy Now |
Part Details for MC9328MX21CJMR2
MC9328MX21CJMR2 CAD Models
MC9328MX21CJMR2 Part Data Attributes
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MC9328MX21CJMR2
NXP Semiconductors
Buy Now
Datasheet
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MC9328MX21CJMR2
NXP Semiconductors
32-BIT, 266MHz, PBGA289
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | LFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Additional Feature | ALSO REQUIRES 3.3 V I/O SUPPLY | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 32 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B289 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 289 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.6 mm | |
| Speed | 266 MHz | |
| Supply Voltage-Max | 1.65 V | |
| Supply Voltage-Min | 1.45 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 17 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |