Part Details for ML22Q665-NNNTBZ0BX by LAPIS Semiconductor Co Ltd
Overview of ML22Q665-NNNTBZ0BX by LAPIS Semiconductor Co Ltd
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Applications
Education and Research
Security and Surveillance
Audio and Video Systems
Aerospace and Defense
Transportation and Logistics
Healthcare
Agriculture Technology
Renewable Energy
Automotive
Robotics and Drones
Part Details for ML22Q665-NNNTBZ0BX
ML22Q665-NNNTBZ0BX CAD Models
ML22Q665-NNNTBZ0BX Part Data Attributes
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ML22Q665-NNNTBZ0BX
LAPIS Semiconductor Co Ltd
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ML22Q665-NNNTBZ0BX
LAPIS Semiconductor Co Ltd
Speech Synthesizer, 652s, PQFP32, TQFP-32
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | LAPIS SEMICONDUCTOR CO LTD | |
| Package Description | TQFP-32 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | ALSO OPERATES WITH 3.3TO 5.5V SUPPLY | |
| Application | VOICE SYNTHESIS | |
| Consumer IC Type | SPEECH SYNTHESIZER | |
| JESD-30 Code | S-PQFP-G32 | |
| Length | 7 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| On Chip Memory Type | FLASH | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HTQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, THIN PROFILE | |
| Reading Time-Max | 652 s | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Width | 7 mm |