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Part Details for MPC5125YVN400 by NXP Semiconductors
Overview of MPC5125YVN400 by NXP Semiconductors
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
Price & Stock for MPC5125YVN400
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
69R7775
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Newark | Microcontroller Mcu, 32 Bit, Power, 400Mhz, Tepbga-324, Product Range:Mpc5 Family Mpc51Xx Series Microcontrollers, Device Core:Power Architecture, Data Bus Width:32 Bit, Operating Frequency Max:400Mhz, Program Memory Size:- Rohs Compliant: Yes |Nxp MPC5125YVN400 Min Qty: 300 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$32.6400 | Buy Now |
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DISTI #
MPC5125YVN400-ND
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DigiKey | IC MCU 32BIT ROMLESS 324PBGA Min Qty: 1 Lead time: 13 Weeks Container: Tray |
294 In Stock |
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$31.3774 / $44.5500 | Buy Now |
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DISTI #
MPC5125YVN400
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Avnet Americas | MCU 32-bit MPC51xx e300 RISC ROMLess 1.4V/1.8V/2.5V/3.3V 324-Pin TE-BGA Tray - Trays (Alt: MPC5125YVN400) RoHS: Compliant Min Qty: 300 Package Multiple: 300 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$26.5674 / $30.6382 | Buy Now |
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DISTI #
841-MPC5125YVN400
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Mouser Electronics | Microprocessors - MPU POWERPC EMBEDDED SOC SOC RoHS: Compliant | 894 |
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$31.3400 / $44.5400 | Buy Now |
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Future Electronics | e300 MPC51xx Microcontroller IC 32-Bit 400MHz ROMless 324-TEPBGA (23x23) RoHS: Compliant pbFree: Yes Min Qty: 300 Package Multiple: 300 Container: Tray | 0Tray |
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$30.0400 | Buy Now |
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DISTI #
77264755
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Verical | MCU 32-bit e300 RISC ROMLess 1.4V/1.8V/2.5V/3.3V 324-Pin TEBGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 2351 | Americas - 300 |
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$32.6250 / $47.6250 | Buy Now |
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DISTI #
MPC5125YVN400
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Avnet Americas | MCU 32-bit MPC51xx e300 RISC ROMLess 1.4V/1.8V/2.5V/3.3V 324-Pin TE-BGA Tray - Trays (Alt: MPC5125YVN400) RoHS: Compliant Min Qty: 300 Package Multiple: 300 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$26.5674 / $30.6382 | Buy Now |
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Chip 1 Exchange | INSTOCK | 13265 |
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RFQ | |
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DISTI #
MPC5125YVN400
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Avnet Silica | MCU 32-bit MPC51xx e300 RISC ROMLess 1.4V/1.8V/2.5V/3.3V 324-Pin TE-BGA Tray (Alt: MPC5125YVN400) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 15 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
MPC5125YVN400
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EBV Elektronik | MCU 32-bit MPC51xx e300 RISC ROMLess 1.4V/1.8V/2.5V/3.3V 324-Pin TE-BGA Tray (Alt: MPC5125YVN400) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for MPC5125YVN400
MPC5125YVN400 CAD Models
MPC5125YVN400 Part Data Attributes:
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MPC5125YVN400
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MPC5125YVN400
NXP Semiconductors
32-BIT, FLASH, 400MHz, MICROCONTROLLER, PBGA324
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 23 X 23 MM, 2.25 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034AJJ-1, TEPBGA-324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Samacsys Manufacturer | NXP | |
| Has ADC | NO | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Clock Frequency-Max | 35 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e2 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 128 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 2.55 mm | |
| Speed | 400 MHz | |
| Supply Voltage-Max | 1.47 V | |
| Supply Voltage-Min | 1.33 V | |
| Supply Voltage-Nom | 1.4 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |