Part Details for MPC5534MVM80 by Freescale Semiconductor
Overview of MPC5534MVM80 by Freescale Semiconductor
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Transportation and Logistics
Healthcare
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for MPC5534MVM80
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
MPC5534MVM80
|
Direct Components, Inc. | MCU 32-bit e200z6 RISC 1MB Flash 1.8V/2.5V/3.3V/5V Automotive 208-Pin MAP-BGA Tray | 200 |
|
RFQ |
Part Details for MPC5534MVM80
MPC5534MVM80 CAD Models
MPC5534MVM80 Part Data Attributes
|
MPC5534MVM80
Freescale Semiconductor
Buy Now
Datasheet
|
Compare Parts:
MPC5534MVM80
Freescale Semiconductor
Freescale 32-bit MCU, Power Arch, 1MB Flash, 80MHz, -40/+125degC, Automotive Grade, MAPBGA 208
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 17 X 17 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MO-151AAF-1, MAPBGA-208 | |
Pin Count | 208 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
Clock Frequency-Max | 40 MHz | |
DAC Channels | YES | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B208 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 208 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA208,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 1048576 | |
ROM Programmability | FLASH | |
Seated Height-Max | 2 mm | |
Speed | 80 MHz | |
Supply Current-Max | 250 mA | |
Supply Voltage-Max | 1.65 V | |
Supply Voltage-Min | 1.35 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 17 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |