Part Details for MPC8377CVRALGA by NXP Semiconductors
Overview of MPC8377CVRALGA by NXP Semiconductors
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Part Details for MPC8377CVRALGA
MPC8377CVRALGA CAD Models
MPC8377CVRALGA Part Data Attributes
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MPC8377CVRALGA
NXP Semiconductors
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Datasheet
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MPC8377CVRALGA
NXP Semiconductors
MICROPROCESSOR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | TEBGA2-689 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 15 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B689 | |
| JESD-609 Code | e2 | |
| Length | 31 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 689 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA689,29X29,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.46 mm | |
| Speed | 667 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 31 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |