Part Details for MPC853TVR66A by NXP Semiconductors
Overview of MPC853TVR66A by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Agriculture Technology
Electronic Manufacturing
Robotics and Drones
Price & Stock for MPC853TVR66A
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip1Cloud | IC MPU MPC8XX 66MHZ 256BGA | 3580 |
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RFQ | |
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DISTI #
2820357
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element14 Asia-Pacific | RoHS: Compliant Min Qty: 1 Container: Each | 0 |
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$27.8514 / $31.9241 | Buy Now |
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DISTI #
2820357
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Farnell | MPU, 32BIT, 66MHZ, BGA-256 RoHS: Compliant Min Qty: 1 Lead time: 13 Weeks, 1 Days Container: Each | 0 |
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$22.8157 / $24.7975 | Buy Now |
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Flip Electronics | Stock, ship today | 180 |
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$22.0600 | RFQ |
Part Details for MPC853TVR66A
MPC853TVR66A CAD Models
MPC853TVR66A Part Data Attributes:
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MPC853TVR66A
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MPC853TVR66A
NXP Semiconductors
32-BIT, 66MHz, RISC PROCESSOR, PBGA256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 23 X 23 MM, 2.54 MM HEIGHT, 1.27 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, BGA-256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | NXP | |
| Additional Feature | ALSO REQUIRES 3.3V I/O SUPPLY | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 66 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 2.54 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |