Part Details for MPC885CZP66 by Freescale Semiconductor
Overview of MPC885CZP66 by Freescale Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC885CZP66
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MPC885CZP66-600055-ND
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DigiKey | POWERQUICC, 32 BIT POWER ARCHITE Min Qty: 7 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
97 In Stock |
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$49.9500 | Buy Now |
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Rochester Electronics | MPC885 - PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 100C RoHS: Compliant Status: Obsolete Min Qty: 1 | 97 |
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$42.8600 / $50.4300 | Buy Now |
Part Details for MPC885CZP66
MPC885CZP66 CAD Models
MPC885CZP66 Part Data Attributes
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MPC885CZP66
Freescale Semiconductor
Buy Now
Datasheet
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Compare Parts:
MPC885CZP66
Freescale Semiconductor
PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 100C
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-357 | |
| Pin Count | 357 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 5A002 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 357 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.52 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC885CZP66
This table gives cross-reference parts and alternative options found for MPC885CZP66. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC885CZP66, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC885CVR66 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | MPC885CZP66 vs MPC885CVR66 |