Part Details for MPC885VR66 by NXP Semiconductors
Overview of MPC885VR66 by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC885VR66
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MPC885VR66
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Avnet Americas | MPU MPC8xx RISC 32-Bit 0.18um 66MHz 3.3V 357-Pin BGA Tray - Trays (Alt: MPC885VR66) RoHS: Compliant Min Qty: 7 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 5231 Partner Stock |
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$47.6532 / $54.9549 | Buy Now |
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Rochester Electronics | MPC885 - PowerQUICC 32 Bit Power Architecture, 66MHz, Communications Processor, 0 to 95C RoHS: Compliant Status: Obsolete Min Qty: 1 | 264 |
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$47.6400 / $56.0500 | Buy Now |
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Flip Electronics | Stock, ship today | 11142 |
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RFQ |
Part Details for MPC885VR66
MPC885VR66 CAD Models
MPC885VR66 Part Data Attributes
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MPC885VR66
NXP Semiconductors
Buy Now
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Compare Parts:
MPC885VR66
NXP Semiconductors
32-BIT, 66MHz, RISC PROCESSOR, PBGA357
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | LEAD FREE, PLASTIC, BGA-357 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e1 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 357 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.52 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC885VR66
This table gives cross-reference parts and alternative options found for MPC885VR66. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC885VR66, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC885ZP66 | PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | MPC885VR66 vs MPC885ZP66 |
| MPC885VR66 | PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | MPC885VR66 vs MPC885VR66 |