There are no models available for this part yet.
Overview of MPC885ZP66 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 3 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC885ZP66 by NXP Semiconductors
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
MPC885ZP66
|
Avnet Americas | MPU MPC8xx RISC 32-Bit 0.18um 66MHz 3.3V 357-Pin BGA Tray - Trays (Alt: MPC885ZP66) RoHS: Not Compliant Min Qty: 9 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 1711 Partner Stock |
|
$35.7368 / $41.2126 | Buy Now | |
|
DISTI #
MPC885ZP66
|
EBV Elektronik | MPU MPC8xx RISC 32-Bit 0.18um 66MHz 3.3V 357-Pin BGA Tray (Alt: MPC885ZP66) RoHS: Not Compliant Min Qty: 44 Package Multiple: 44 Lead time: 27 Weeks, 0 Days | EBV - 0 |
|
Buy Now | ||
| Flip Electronics | Stock | 1036 |
|
RFQ |
CAD Models for MPC885ZP66 by NXP Semiconductors
Part Data Attributes for MPC885ZP66 by NXP Semiconductors
|
MPC885ZP66
NXP Semiconductors
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
|
Package Description
|
PLASTIC, BGA-357
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
5A002.A.1
|
|
HTS Code
|
8542.31.00.01
|
|
Factory Lead Time
|
4 Weeks
|
|
Address Bus Width
|
32
|
|
Bit Size
|
32
|
|
Boundary Scan
|
YES
|
|
External Data Bus Width
|
32
|
|
Format
|
FIXED POINT
|
|
Integrated Cache
|
YES
|
|
JESD-30 Code
|
S-PBGA-B357
|
|
JESD-609 Code
|
e0
|
|
Length
|
25 mm
|
|
Low Power Mode
|
YES
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Terminals
|
357
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
BGA
|
|
Package Equivalence Code
|
BGA357,19X19,50
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY
|
|
Peak Reflow Temperature (Cel)
|
245
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
2.52 mm
|
|
Speed
|
66 MHz
|
|
Supply Voltage-Max
|
1.9 V
|
|
Supply Voltage-Min
|
1.7 V
|
|
Supply Voltage-Nom
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
25 mm
|
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
Want to compare parts?
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MPC885ZP66NXP Semiconductors32-BIT, 66MHz, RISC PROCESSOR, PBGA357VS
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Alternate Parts for MPC885ZP66
This table gives cross-reference parts and alternative options found for MPC885ZP66. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC885ZP66, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC885ZP66 | PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | MPC885ZP66 vs MPC885ZP66 |
| MPC885VR66 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | MPC885ZP66 vs MPC885VR66 |
| MPC885VR66 | PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | MPC885ZP66 vs MPC885VR66 |