Part Details for MR2A08ACMA35R by Everspin Technologies
Overview of MR2A08ACMA35R by Everspin Technologies
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Price & Stock for MR2A08ACMA35R
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
MR2A08ACMA35R-ND
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DigiKey | IC RAM 4MBIT PARALLEL 48FBGA Min Qty: 2000 Lead time: 16 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$22.9175 | Buy Now |
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DISTI #
936-MR2A08ACMA35R
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Mouser Electronics | MRAM 4Mb 3.3V 35ns 512Kx8 Parallel MRAM RoHS: Compliant | 0 |
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$22.2500 | Order Now |
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Future Electronics | MR2A08 Series 512 K x 8 Bit 3.3 V 35 ns Asynchronous MRAM Memory - BGA-48 T/R RoHS: Compliant pbFree: Yes Min Qty: 2000 Package Multiple: 2000 Container: Reel | 0Reel |
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$21.8200 | Buy Now |
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DISTI #
MR2A08ACMA35R
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EBV Elektronik | (Alt: MR2A08ACMA35R) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 17 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for MR2A08ACMA35R
MR2A08ACMA35R CAD Models
MR2A08ACMA35R Part Data Attributes:
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MR2A08ACMA35R
Everspin Technologies
Buy Now
Datasheet
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Compare Parts:
MR2A08ACMA35R
Everspin Technologies
Memory Circuit, 512KX8, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | EVERSPIN TECHNOLOGIES INC | |
| Part Package Code | BGA | |
| Package Description | LFBGA, | |
| Pin Count | 48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Samacsys Manufacturer | Everspin Technologies | |
| JESD-30 Code | S-PBGA-B48 | |
| Length | 8 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.35 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 8 mm |