Part Details for MSC8122TVT4800V by NXP Semiconductors
Overview of MSC8122TVT4800V by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MSC8122TVT4800V
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Rochester Electronics | Digital Signal Processor, 16-Bit Size, 32-Ext Bit, 300MHz PBGA431 RoHS: Compliant Status: Obsolete Min Qty: 1 | 24 |
|
$160.6000 / $188.9400 | Buy Now |
DISTI #
MSC8122TVT4800V
|
EBV Elektronik | DSP 32-Bit/64-Bit 300MHz 431-Pin FC-BGA Tray (Alt: MSC8122TVT4800V) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 27 Weeks, 0 Days | EBV - 0 |
|
Buy Now | |
|
Flip Electronics | Stock | 5366 |
|
RFQ |
Part Details for MSC8122TVT4800V
MSC8122TVT4800V CAD Models
MSC8122TVT4800V Part Data Attributes
|
MSC8122TVT4800V
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
MSC8122TVT4800V
NXP Semiconductors
Digital Signal Processor, 32-Ext Bit, 300MHz, CMOS, PBGA431
|
Rohs Code | Yes | |
Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | LEAD FREE, FCBGA-431 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | NXP | |
Address Bus Width | 32 | |
Barrel Shifter | NO | |
Boundary Scan | YES | |
Clock Frequency-Max | 300 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PBGA-B431 | |
JESD-609 Code | e2 | |
Length | 20 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 431 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 250 | |
Seated Height-Max | 3.3 mm | |
Supply Voltage-Max | 1.13 V | |
Supply Voltage-Min | 1.07 V | |
Supply Voltage-Nom | 1.1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver (Sn/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 20 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |