Part Details for MT29F256G08CKCABH2-12Z:A by Micron Technology Inc
Overview of MT29F256G08CKCABH2-12Z:A by Micron Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MT29F256G08CKCABH2-12Z:A
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MT29F256G08CKCABH2
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Avnet Americas | 32GX8 NAND FLASH PLASTIC PBF TBGA 3.3V SYNCH/PAGE READ MASS - Bulk (Alt: MT29F256G08CKCABH2) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 18 Weeks, 0 Days Container: Bulk | 0 |
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RFQ | |
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DISTI #
MT29F256G08CKCABH2
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Avnet Americas | 32GX8 NAND FLASH PLASTIC PBF TBGA 3.3V SYNCH/PAGE READ MASS - Bulk (Alt: MT29F256G08CKCABH2) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 18 Weeks, 0 Days Container: Bulk | 0 |
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RFQ |
Part Details for MT29F256G08CKCABH2-12Z:A
MT29F256G08CKCABH2-12Z:A CAD Models
MT29F256G08CKCABH2-12Z:A Part Data Attributes:
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MT29F256G08CKCABH2-12Z:A
Micron Technology Inc
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Datasheet
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MT29F256G08CKCABH2-12Z:A
Micron Technology Inc
Flash, 32GX8, PBGA100, 12 X 18 MM, 1.20 MM HEIGHT, LEAD FREE, TBGA-100
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 18 MM, 1.20 MM HEIGHT, LEAD FREE, TBGA-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Factory Lead Time | 18 Weeks | |
| JESD-30 Code | R-PBGA-B100 | |
| JESD-609 Code | e1 | |
| Length | 18 mm | |
| Memory Density | 274877906944 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Words | 34359738368 words | |
| Number of Words Code | 32000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32GX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 2.7 V | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Type | MLC NAND TYPE | |
| Width | 12 mm |