Part Details for MT35XL01GBBA1G12-0SIT by Micron Technology Inc
Overview of MT35XL01GBBA1G12-0SIT by Micron Technology Inc
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for MT35XL01GBBA1G12-0SIT
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
83AH2714
|
Newark | Flash Memory, 1Gbit, -40 To 85Deg C, Flash Memory Type:Serial Nor, Memory Configuration:128M X 8Bit, Interfaces:Spi, Ic Case/Package:Tbga, No. Of Pins:24Pins, Clock Frequency Max:133Mhz, Access Time:-, Supply Voltage Min:2.7V Rohs Compliant: Yes |Micron MT35XL01GBBA1G12-0SIT Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 275 |
|
$2.9800 | Buy Now |
DISTI #
71250445
|
Verical | 1Gb 1.8V Memory Min Qty: 17 Package Multiple: 1 | Americas - 275 |
|
$4.0470 / $4.6929 | Buy Now |
DISTI #
3530752
|
element14 Asia-Pacific | FLASH MEMORY, 1GBIT, -40 TO 85DEG C RoHS: Compliant Min Qty: 1 Container: Each | 607 |
|
$19.1988 / $21.5053 | Buy Now |
DISTI #
3530752
|
Farnell | FLASH MEMORY, 1GBIT, -40 TO 85DEG C RoHS: Compliant Min Qty: 1 Lead time: 13 Weeks, 1 Days Container: Each | 607 |
|
$7.8581 / $11.3506 | Buy Now |
Part Details for MT35XL01GBBA1G12-0SIT
MT35XL01GBBA1G12-0SIT CAD Models
MT35XL01GBBA1G12-0SIT Part Data Attributes
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MT35XL01GBBA1G12-0SIT
Micron Technology Inc
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Datasheet
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MT35XL01GBBA1G12-0SIT
Micron Technology Inc
Flash, 1GX1, PBGA24, TBGA-24
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Package Description | TBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Factory Lead Time | 30 Weeks, 4 Days | |
Samacsys Manufacturer | Micron | |
Clock Frequency-Max (fCLK) | 133 MHz | |
JESD-30 Code | R-PBGA-B24 | |
JESD-609 Code | e1 | |
Length | 8 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | FLASH | |
Memory Width | 1 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 1073741824 words | |
Number of Words Code | 1000000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1GX1 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 3 V | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 6 mm |