Part Details for P2020NSN2KHC by NXP Semiconductors
Overview of P2020NSN2KHC by NXP Semiconductors
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for P2020NSN2KHC
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
22T5446
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Newark | Microprocessor-Mpu, 32 Bit, 1.2Ghz, Bga-689, Product Range:Qoriq Family P2020 Series Microprocessors, No. Of Cpu Cores:2Cores, Program Memory Size:-, Ic Case/Package:Bga, No. Of Pins:689Pins, Supply Voltage Min:-, Qualification:- Rohs Compliant: Yes |Nxp P2020NSN2KHC Min Qty: 27 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
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Chip1Cloud | IC MPU Q OR IQ 1.2GHZ 689TEBGA | 2490 |
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RFQ | |
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DISTI #
4376502
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Farnell | MICROPROCESSOR, 1.2MHZ, BGA-689 RoHS: Compliant Min Qty: 27 Lead time: 3 Weeks, 1 Days Container: Each | 8 |
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$215.1892 | Buy Now |
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Flip Electronics | Stock | 1458 |
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RFQ | |
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Perfect Parts Corporation | 2 |
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RFQ |
Part Details for P2020NSN2KHC
P2020NSN2KHC CAD Models
P2020NSN2KHC Part Data Attributes
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P2020NSN2KHC
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
P2020NSN2KHC
NXP Semiconductors
1000MHz, RISC PROCESSOR, PBGA689
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | TEBGA-689 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 16 | |
| Boundary Scan | YES | |
| External Data Bus Width | 64 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B689 | |
| JESD-609 Code | e2 | |
| Length | 31 mm | |
| Low Power Mode | NO | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 4 | |
| Number of External Interrupts | 7 | |
| Number of Terminals | 689 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA689,29X29,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.46 mm | |
| Speed | 1000 MHz | |
| Supply Voltage-Max | 1.1 V | |
| Supply Voltage-Min | 1 V | |
| Supply Voltage-Nom | 1.05 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 31 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |