Part Details for S25FL128SAGBHI200 by Spansion
Overview of S25FL128SAGBHI200 by Spansion
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Computing and Data Storage
Healthcare
Price & Stock for S25FL128SAGBHI200
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Bristol Electronics | 32 |
|
RFQ | ||
|
|
Quest Components | 128MX1 FLASH 3V PROM | 25 |
|
$3.4800 / $5.2200 | Buy Now |
|
|
Component Electronics, Inc | IN STOCK SHIP TODAY | 1 |
|
$3.0000 / $4.6200 | Buy Now |
Part Details for S25FL128SAGBHI200
S25FL128SAGBHI200 CAD Models
S25FL128SAGBHI200 Part Data Attributes
|
|
S25FL128SAGBHI200
Spansion
Buy Now
Datasheet
|
Compare Parts:
S25FL128SAGBHI200
Spansion
Flash, 32MX4, PBGA24, FBGA-24
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-24 | |
| Pin Count | 24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Spansion | |
| Additional Feature | ALSO CONFIGURABLE AS 128M X 1 | |
| Alternate Memory Width | 2 | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX4 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Cycle Time-Max (tWC) | 500 ms | |
| Write Protection | HARDWARE/SOFTWARE |