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Part Details for S25FL256SAGBHI203 by Infineon Technologies AG
Overview of S25FL256SAGBHI203 by Infineon Technologies AG
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Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for S25FL256SAGBHI203
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
448-S25FL256SAGBHI203CT-ND
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DigiKey | IC FLASH 256MBIT SPI/QUAD 24BGA Min Qty: 1 Lead time: 8 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
1966 In Stock |
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$3.7722 / $5.4600 | Buy Now |
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DISTI #
727-25FL256SAGBHI203
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Mouser Electronics | NOR Flash STD SPI RoHS: Compliant | 448 |
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$3.6600 / $5.3100 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Container: Reel | 0Reel |
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$3.2800 | Buy Now |
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Ameya Holding Limited | IC FLASH 256M SPI 133MHZ 24BGA | 224 |
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RFQ |
Part Details for S25FL256SAGBHI203
S25FL256SAGBHI203 CAD Models
S25FL256SAGBHI203 Part Data Attributes
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S25FL256SAGBHI203
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
S25FL256SAGBHI203
Infineon Technologies AG
Flash, 64MX4, PBGA24,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Infineon | |
| Additional Feature | ALSO CONFIGURABLE AS 128M X 1 | |
| Alternate Memory Width | 2 | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| JESD-609 Code | e1 | |
| Length | 8 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 4 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX4 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Cycle Time-Max (tWC) | 500 ms | |
| Write Protection | HARDWARE/SOFTWARE |