Datasheets
S25FL256SDSBHI200 by:

Flash, 32MX8, PBGA24, FBGA-24

Part Details for S25FL256SDSBHI200 by Cypress Semiconductor

Overview of S25FL256SDSBHI200 by Cypress Semiconductor

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Price & Stock for S25FL256SDSBHI200

Part # Distributor Description Stock Price Buy
Flip Electronics Stock 325
RFQ

Part Details for S25FL256SDSBHI200

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S25FL256SDSBHI200 Part Data Attributes

S25FL256SDSBHI200 Cypress Semiconductor
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S25FL256SDSBHI200 Cypress Semiconductor Flash, 32MX8, PBGA24, FBGA-24
Part Life Cycle Code Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Package Description TBGA,
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Boot Block BOTTOM
Clock Frequency-Max (fCLK) 80 MHz
JESD-30 Code R-PBGA-B24
Length 8 mm
Memory Density 268435456 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 32MX8
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL
Programming Voltage 3 V
Seated Height-Max 1.2 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Type NOR TYPE
Width 6 mm

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