Datasheets
S25FS128SAGBHI200 by:

Flash, 16MX8, PDGA24, BGA-24

Part Details for S25FS128SAGBHI200 by Infineon Technologies AG

Overview of S25FS128SAGBHI200 by Infineon Technologies AG

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Applications Computing and Data Storage

Price & Stock for S25FS128SAGBHI200

Part # Distributor Description Stock Price Buy
DISTI # 448-S25FS128SAGBHI200-ND
DigiKey IC FLASH 128MBIT SPI/QUAD 24BGA Min Qty: 1 Lead time: 8 Weeks Container: Tray 417
In Stock
  • 1 $4.2000
  • 10 $3.8120
  • 25 $3.7296
  • 40 $3.7095
  • 80 $3.3260
  • 338 $3.3138
  • 676 $3.1928
  • 1,014 $3.0354
$3.0354 / $4.2000 Buy Now
DISTI # 797-25FS128SAGBHI200
Mouser Electronics NOR Flash 128Mb, 1.8V, 133Mhz MirrorBit SPI Flash RoHS: Compliant 443
  • 1 $4.0800
  • 10 $3.2300
  • 100 $3.2200
  • 250 $3.0500
  • 676 $2.8900
  • 2,704 $2.8800
$2.8800 / $4.0800 Buy Now
Future Electronics FLASH - NOR Memory IC 128Mb (16M x 8) SPI - Quad I/O 133MHz 24-BGA (8x6) RoHS: Compliant pbFree: Yes Min Qty: 676 Package Multiple: 338 Container: Tray 0
Tray
  • 338 $2.9200
  • 1,352 $2.8800
  • 2,028 $2.8600
  • 2,704 $2.8400
  • 3,380 $2.7800
$2.7800 / $2.9200 Buy Now
Ameya Holding Limited   221
RFQ

Part Details for S25FS128SAGBHI200

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S25FS128SAGBHI200 Part Data Attributes

S25FS128SAGBHI200 Infineon Technologies AG
Buy Now Datasheet
Compare Parts:
S25FS128SAGBHI200 Infineon Technologies AG Flash, 16MX8, PDGA24, BGA-24
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description BGA-24
Reach Compliance Code compliant
Samacsys Manufacturer Infineon
Clock Frequency-Max (fCLK) 133 MHz
Data Retention Time-Min 2
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PBGA-B24
Length 8 mm
Memory Density 134217728 bit
Memory IC Type FLASH
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 24
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 16MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA24,5X5,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 1.8 V
Seated Height-Max 1.2 mm
Serial Bus Type SPI
Standby Current-Max 0.0003 A
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 2 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 6 mm
Write Protection HARDWARE/SOFTWARE

Alternate Parts for S25FS128SAGBHI200

This table gives cross-reference parts and alternative options found for S25FS128SAGBHI200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S25FS128SAGBHI200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
S25FS128SAGBHI200 Flash, 128MX1, PBGA24, BGA-24 Cypress Semiconductor S25FS128SAGBHI200 vs S25FS128SAGBHI200
Part Number Description Manufacturer Compare
S25FS128SAGBHI200 Flash, 128MX1, PBGA24, BGA-24 Cypress Semiconductor S25FS128SAGBHI200 vs S25FS128SAGBHI200

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