SC5554MZP112R2 by:

IC,MICROCONTROLLER,32-BIT,CMOS,BGA,416PIN,PLASTIC

Part Details for SC5554MZP112R2 by NXP Semiconductors

Overview of SC5554MZP112R2 by NXP Semiconductors

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Price & Stock for SC5554MZP112R2

Part # Distributor Description Stock Price Buy
Flip Electronics Stock 105
RFQ

Part Details for SC5554MZP112R2

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SC5554MZP112R2 Part Data Attributes

SC5554MZP112R2 NXP Semiconductors
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SC5554MZP112R2 NXP Semiconductors IC,MICROCONTROLLER,32-BIT,CMOS,BGA,416PIN,PLASTIC
Rohs Code No
Part Life Cycle Code Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Bit Size 32
JESD-30 Code S-PBGA-B416
JESD-609 Code e4
Moisture Sensitivity Level 3
Number of Terminals 416
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA416,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
RAM (bytes) 65536
ROM (words) 2097152
ROM Programmability FLASH
Speed 112 MHz
Supply Current-Max 875 mA
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Gold (Ni/Au)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30

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