Part Details for SC5554MZP112R2 by NXP Semiconductors
Overview of SC5554MZP112R2 by NXP Semiconductors
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Price & Stock for SC5554MZP112R2
Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock | 105 |
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RFQ |
Part Details for SC5554MZP112R2
SC5554MZP112R2 CAD Models
SC5554MZP112R2 Part Data Attributes
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SC5554MZP112R2
NXP Semiconductors
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SC5554MZP112R2
NXP Semiconductors
IC,MICROCONTROLLER,32-BIT,CMOS,BGA,416PIN,PLASTIC
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Rohs Code | No | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Bit Size | 32 | |
JESD-30 Code | S-PBGA-B416 | |
JESD-609 Code | e4 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 416 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA416,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 2097152 | |
ROM Programmability | FLASH | |
Speed | 112 MHz | |
Supply Current-Max | 875 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Nickel/Gold (Ni/Au) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 |