Part Details for SPC5553MZQ112 by NXP Semiconductors
Overview of SPC5553MZQ112 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for SPC5553MZQ112
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
SPC5553MZQ112
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Avnet Silica | BGA-324 / A/ 32-bit MCU, Power Arch, 1.5MB Flash, 112MHz / 12NC: 935314337557 (Alt: SPC5553MZQ112) RoHS: Not Compliant Min Qty: 60 Package Multiple: 60 Lead time: 7 Weeks, 5 Days | Silica - 0 |
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Buy Now | |
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DISTI #
SPC5553MZQ112
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EBV Elektronik | BGA-324 / A/ 32-bit MCU, Power Arch, 1.5MB Flash, 112MHz / 12NC: 935314337557 (Alt: SPC5553MZQ112) RoHS: Not Compliant Min Qty: 60 Package Multiple: 60 Lead time: 7 Weeks, 5 Days | EBV - 0 |
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Buy Now |
Part Details for SPC5553MZQ112
SPC5553MZQ112 CAD Models
SPC5553MZQ112 Part Data Attributes:
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SPC5553MZQ112
NXP Semiconductors
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Datasheet
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Compare Parts:
SPC5553MZQ112
NXP Semiconductors
IC,MICROCONTROLLER,32-BIT,E200 CPU,CMOS,BGA,324PIN,PLASTIC
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| Rohs Code | No | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA, BGA324,22X22,40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Boundary Scan | NO | |
| CPU Family | E200 | |
| Clock Frequency-Max | 20 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B324 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 324 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 65536 | |
| ROM (words) | 1572864 | |
| ROM Programmability | FLASH | |
| Screening Level | AEC-Q100 | |
| Speed | 114 MHz | |
| Supply Current-Max | 460 mA | |
| Supply Voltage-Max | 1.65 V | |
| Supply Voltage-Min | 1.35 V | |
| Supply Voltage-Nom | 1.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |