Part Details for SPC5602DF1MLH4 by Freescale Semiconductor
Overview of SPC5602DF1MLH4 by Freescale Semiconductor
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Part Details for SPC5602DF1MLH4
SPC5602DF1MLH4 CAD Models
SPC5602DF1MLH4 Part Data Attributes:
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SPC5602DF1MLH4
Freescale Semiconductor
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SPC5602DF1MLH4
Freescale Semiconductor
Freescale 32-bit MCU, Power Arch core, 256KB Flash, 48MHz, -40/+125degC, Automotive Grade, QFP 64
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | LQFP-64 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | E200 | |
Clock Frequency-Max | 16 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | S-PQFP-G64 | |
JESD-609 Code | e3 | |
Length | 10 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 45 | |
Number of Terminals | 64 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP64,.47SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 16384 | |
ROM (words) | 262144 | |
ROM Programmability | FLASH | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.6 mm | |
Speed | 48 MHz | |
Supply Current-Max | 130 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |