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Part Details for TC58NVG1S3HBAI6 by Toshiba America Electronic Components
Overview of TC58NVG1S3HBAI6 by Toshiba America Electronic Components
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Price & Stock for TC58NVG1S3HBAI6
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | 80 |
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$5.3946 / $8.7480 | Buy Now |
Part Details for TC58NVG1S3HBAI6
TC58NVG1S3HBAI6 CAD Models
TC58NVG1S3HBAI6 Part Data Attributes
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TC58NVG1S3HBAI6
Toshiba America Electronic Components
Buy Now
Datasheet
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TC58NVG1S3HBAI6
Toshiba America Electronic Components
2GB SLC NAND 24NM BGA 6.5X8 (EEPROM)
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | BGA | |
| Package Description | VFBGA, | |
| Pin Count | 67 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Toshiba | |
| JESD-30 Code | R-PBGA-B67 | |
| Length | 8 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 67 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 3.3 V | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Type | SLC NAND TYPE | |
| Width | 6.5 mm |