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Part Details for TC58NVG1S3HTA00 by Toshiba America Electronic Components
Overview of TC58NVG1S3HTA00 by Toshiba America Electronic Components
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for TC58NVG1S3HTA00
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 3098 |
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RFQ | ||
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Bristol Electronics | 34 |
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RFQ | ||
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Quest Components | 2478 |
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$2.1294 / $4.2588 | Buy Now | |
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Quest Components | 27 |
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$2.6026 / $3.5490 | Buy Now | |
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DISTI #
SMC-TC58NVG1S3HTA00
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Sensible Micro Corporation | AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days Date Code: 23+ | 200000 |
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RFQ |
Part Details for TC58NVG1S3HTA00
TC58NVG1S3HTA00 CAD Models
TC58NVG1S3HTA00 Part Data Attributes
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TC58NVG1S3HTA00
Toshiba America Electronic Components
Buy Now
Datasheet
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Compare Parts:
TC58NVG1S3HTA00
Toshiba America Electronic Components
2GB SLC NAND TSOP 24NM LB (EEPROM)
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | TSOP1 | |
| Package Description | TSOP1-48 | |
| Pin Count | 48 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Toshiba | |
| JESD-30 Code | R-PDSO-G48 | |
| Length | 18.4 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP | |
| Package Equivalence Code | TSSOP48,.8,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3.3 V | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Type | SLC NAND TYPE | |
| Width | 12 mm | |
| Write Protection | HARDWARE |