Part Details for TH50VSF1461ACXB by Toshiba America Electronic Components
Overview of TH50VSF1461ACXB by Toshiba America Electronic Components
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for TH50VSF1461ACXB
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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Quest Components | 1472 |
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$2.0949 / $4.1898 | Buy Now | |
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Sense Electronic Company Limited | BGA | 1266 |
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RFQ |
Part Details for TH50VSF1461ACXB
TH50VSF1461ACXB CAD Models
TH50VSF1461ACXB Part Data Attributes:
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TH50VSF1461ACXB
Toshiba America Electronic Components
Buy Now
Datasheet
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Compare Parts:
TH50VSF1461ACXB
Toshiba America Electronic Components
IC,MIXED MEMORY,FLASH+SRAM,HYBRID,BGA,48PIN,PLASTIC
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Package Description | BGA, BGA48,6X8,40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 100 ns | |
| JESD-30 Code | R-PBGA-B48 | |
| JESD-609 Code | e0 | |
| Memory IC Type | MEMORY CIRCUIT | |
| Mixed Memory Type | FLASH+SRAM | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA48,6X8,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.00003 A | |
| Supply Current-Max | 0.06 mA | |
| Surface Mount | YES | |
| Technology | HYBRID | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM |