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Dual, 6-V, 220-kHz, low quiescent current (23-µA), RRIO operational amplifier 8-VSSOP 0 to 70
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
296-10580-1-ND
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DigiKey | IC OPAMP GP 2 CIRCUIT 8VSSOP Min Qty: 1 Lead time: 6 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
5535 In Stock |
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$1.1869 / $2.6900 | Buy Now |
DISTI #
595-TLV2452CDGKR
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Mouser Electronics | Operational Amplifiers - Op Amps Dual Mcrpwr R-to-R Input/Output Op Amp RoHS: Compliant | 0 |
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$1.1200 / $2.5100 | Order Now |
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Bristol Electronics | 25 |
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RFQ | ||
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Ameya Holding Limited | IC OPAMP GP 2 CIRCUIT 8VSSOP | 2540 |
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RFQ | |
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LCSC | 500pA Dual 220kHz VSSOP-8 Operational Amplifier ROHS | 10 |
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$2.8494 / $3.9876 | Buy Now |
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TLV2452CDGKR
Texas Instruments
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Datasheet
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TLV2452CDGKR
Texas Instruments
Dual, 6-V, 220-kHz, low quiescent current (23-µA), RRIO operational amplifier 8-VSSOP 0 to 70
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | MSOP | |
Package Description | GREEN, PLASTIC, MSOP-8 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Amplifier Type | OPERATIONAL AMPLIFIER | |
Architecture | VOLTAGE-FEEDBACK | |
Average Bias Current-Max (IIB) | 0.007 µA | |
Bias Current-Max (IIB) @25C | 0.005 µA | |
Common-mode Reject Ratio-Min | 70 dB | |
Common-mode Reject Ratio-Nom | 80 dB | |
Frequency Compensation | YES | |
Input Offset Current-Max (IIO) | 0.00045 µA | |
Input Offset Voltage-Max | 1500 µV | |
JESD-30 Code | S-PDSO-G8 | |
JESD-609 Code | e4 | |
Length | 3 mm | |
Low-Bias | NO | |
Low-Offset | NO | |
Micropower | YES | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 2 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP8,.19 | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Power | NO | |
Programmable Power | NO | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.1 mm | |
Slew Rate-Min | 0.02 V/us | |
Slew Rate-Nom | 0.11 V/us | |
Supply Current-Max | 0.084 mA | |
Supply Voltage Limit-Max | 7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Unity Gain BW-Nom | 220 | |
Voltage Gain-Min | 63095 | |
Wideband | NO | |
Width | 3 mm |