Part Details for TMPA911CRXBG by Toshiba America Electronic Components
Overview of TMPA911CRXBG by Toshiba America Electronic Components
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for TMPA911CRXBG
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
TMPA911CRXBG
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EBV Elektronik | High-performance 32-bit RISC microcontrollers with a USB device controller capable of operating at up to 200 MHz (Alt: TMPA911CRXBG) RoHS: Compliant Min Qty: 420 Package Multiple: 420 Lead time: 53 Weeks, 0 Days | EBV - 0 |
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Part Details for TMPA911CRXBG
TMPA911CRXBG CAD Models
TMPA911CRXBG Part Data Attributes
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TMPA911CRXBG
Toshiba America Electronic Components
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Datasheet
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TMPA911CRXBG
Toshiba America Electronic Components
INTEGRATED CIRCUIT MICROCONTROLLER - ARM9 FAMILY
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Package Description | LFBGA, | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Toshiba | |
| Has ADC | YES | |
| Additional Feature | IT ALSO OPERATES AT 150MHZ @-20 TO 85DEGCEN | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 27 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B361 | |
| Length | 16 mm | |
| Number of I/O Lines | 98 | |
| Number of Terminals | 361 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| RAM (bytes) | 57344 | |
| ROM (words) | 16384 | |
| ROM Programmability | MROM | |
| Seated Height-Max | 1.4 mm | |
| Speed | 200 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 16 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |