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Part Details for TMS320DM6443BZWT by Texas Instruments
Overview of TMS320DM6443BZWT by Texas Instruments
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for TMS320DM6443BZWT
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
296-42954-5-ND
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DigiKey | IC DGTL MEDIA SOC 361NFBGA Min Qty: 90 Lead time: 6 Weeks Container: Tray | Limited Supply - Call |
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$42.1673 | Buy Now |
|
DISTI #
595-TMS320DM6443BZWT
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC DaVinci Dig Media Sys-on-Chip RoHS: Compliant | 0 |
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$42.0200 | Order Now |
|
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Ameya Holding Limited | IC DGTL MEDIA SOC 361NFBGA | 610 |
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RFQ | |
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Chip1Cloud | IC DGTL MEDIA SOC 361NFBGA | 1160 |
|
RFQ |
Part Details for TMS320DM6443BZWT
TMS320DM6443BZWT CAD Models
TMS320DM6443BZWT Part Data Attributes:
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TMS320DM6443BZWT
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
TMS320DM6443BZWT
Texas Instruments
DaVinci Digital Media System-on-Chip 361-NFBGA
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA361,19X19,32 | |
| Pin Count | 361 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Bit Size | 32 | |
| Bus Compatibility | ETHERNET; I2C; SPI; UART; USB | |
| External Data Bus Width | 48 | |
| Format | FIXED POINT | |
| JESD-30 Code | S-PBGA-B316 | |
| JESD-609 Code | e1 | |
| Length | 16 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 361 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA361,19X19,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 20480 | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 16 mm | |
| uPs/uCs/Peripheral ICs Type | Digital Media SoC |