Part Details for W972GG6KB25I by Winbond Electronics Corp
Overview of W972GG6KB25I by Winbond Electronics Corp
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Smart Cities
Renewable Energy
Robotics and Drones
Price & Stock for W972GG6KB25I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
256-W972GG6KB25I-ND
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DigiKey | IC DRAM 2GBIT PARALLEL 84WBGA Min Qty: 1 Lead time: 24 Weeks Container: Tray |
26 In Stock |
|
$9.2702 / $12.8600 | Buy Now |
|
DISTI #
454-W972GG6KB25I
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Mouser Electronics | DRAM 2Gb DDR2-800, x16, Ind Temp RoHS: Compliant | 123 |
|
$9.3000 / $12.4800 | Buy Now |
|
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Bristol Electronics | 62 |
|
RFQ | ||
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Quest Components | 49 |
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$9.4350 / $11.4750 | Buy Now | |
|
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NAC | 2Gb DDR2-800, x16, Ind Temp, BGA84 Package RoHS: Compliant Min Qty: 144 Package Multiple: 144 | 0 |
|
$11.8800 / $12.5100 | Buy Now |
|
DISTI #
W972GG6KB25I
|
Avnet Asia | 2GBIT DDR2 WITH INDUSTRIAL GRADE (Alt: W972GG6KB25I) RoHS: Compliant Min Qty: 1672 Package Multiple: 1672 Lead time: 20 Weeks, 0 Days | 0 |
|
RFQ | |
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Chip1Cloud | IC DDR2 SDRAM 2GBIT 2.5NS 84BGA | 8300 |
|
RFQ |
Part Details for W972GG6KB25I
W972GG6KB25I CAD Models
W972GG6KB25I Part Data Attributes:
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W972GG6KB25I
Winbond Electronics Corp
Buy Now
Datasheet
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Compare Parts:
W972GG6KB25I
Winbond Electronics Corp
DDR DRAM, 128MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-84
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | WBGA-84 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Samacsys Manufacturer | Winbond | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.4 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B84 | |
| Length | 12.5 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA84,9X15,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.05 A | |
| Supply Current-Max | 0.22 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 8 mm |