Part Details for XC1765EPDG8C by AMD Xilinx
Overview of XC1765EPDG8C by AMD Xilinx
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
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Part Details for XC1765EPDG8C
XC1765EPDG8C CAD Models
XC1765EPDG8C Part Data Attributes
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XC1765EPDG8C
AMD Xilinx
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Datasheet
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XC1765EPDG8C
AMD Xilinx
Configuration Memory, 64KX1, Serial, CMOS, PDIP8, LEAD FREE, PLASTIC, DIP-8
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | LEAD FREE, PLASTIC, DIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | |
| Clock Frequency-Max (fCLK) | 10 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T8 | |
| JESD-609 Code | e3 | |
| Length | 9.3599 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Memory Width | 1 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 64KX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.5974 mm | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7.62 mm |
Alternate Parts for XC1765EPDG8C
This table gives cross-reference parts and alternative options found for XC1765EPDG8C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC1765EPDG8C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XC1765EPDG8I | Configuration Memory, 64KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC1765EPDG8C vs XC1765EPDG8I |
| XC1765EDD8M | Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | AMD Xilinx | XC1765EPDG8C vs XC1765EDD8M |
| XC1765EPD8C | Configuration Memory, 64KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC1765EPDG8C vs XC1765EPD8C |
| 5962-9471701MPA | Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | AMD Xilinx | XC1765EPDG8C vs 5962-9471701MPA |
| XC1765DPD8C | Configuration Memory, 64KX1, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | AMD Xilinx | XC1765EPDG8C vs XC1765DPD8C |
| XC1765D-DD8M | Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | AMD Xilinx | XC1765EPDG8C vs XC1765D-DD8M |