Part Details for XC3S1000-4FGG320I by AMD
Overview of XC3S1000-4FGG320I by AMD
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Part Details for XC3S1000-4FGG320I
XC3S1000-4FGG320I CAD Models
XC3S1000-4FGG320I Part Data Attributes
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XC3S1000-4FGG320I
AMD
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Datasheet
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XC3S1000-4FGG320I
AMD
Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 630MHz, 17280-Cell, CMOS, PBGA320, 19 X 19 MM, LEAD FREE, FBGA-320
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 19 X 19 MM, LEAD FREE, FBGA-320 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 630 MHz | |
| Combinatorial Delay of a CLB-Max | 0.61 ns | |
| JESD-30 Code | S-PBGA-B320 | |
| JESD-609 Code | e1 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1920 | |
| Number of Equivalent Gates | 1000000 | |
| Number of Inputs | 221 | |
| Number of Logic Cells | 17280 | |
| Number of Outputs | 221 | |
| Number of Terminals | 320 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1920 CLBS, 1000000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA320,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 mm |