Part Details for XC3S2000-4FGG456C by AMD Xilinx
Overview of XC3S2000-4FGG456C by AMD Xilinx
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Telecommunications
Price & Stock for XC3S2000-4FGG456C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 5 |
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RFQ | ||
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DISTI #
SMC-XC3S2000-4FGG456C
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Sensible Micro Corporation | Fpga Spartan-3 Family 2M Gates 46080 Cells 630Mhz 90Nm Technology 1.2V 456-Pin F-Bga - Trays (Alt: Xc3S2000-4Fgg456C) RoHS: Compliant Min Qty: 25 Lead time: 0 Weeks, 1 Days Date Code: 1237 Container: Trays | 10 |
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$100.5241 / $119.3723 | RFQ |
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Sense Electronic Company Limited | BGA@ | 1317 |
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RFQ |
Part Details for XC3S2000-4FGG456C
XC3S2000-4FGG456C CAD Models
XC3S2000-4FGG456C Part Data Attributes:
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XC3S2000-4FGG456C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC3S2000-4FGG456C
AMD Xilinx
Field Programmable Gate Array, 5120 CLBs, 2000000 Gates, 630MHz, 46080-Cell, CMOS, PBGA456, 23 X 23 MM, LEAD FREE, FBGA-456
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, LEAD FREE, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 23 Weeks | |
| Clock Frequency-Max | 630 MHz | |
| Combinatorial Delay of a CLB-Max | 0.61 ns | |
| JESD-30 Code | S-PBGA-B456 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 5120 | |
| Number of Equivalent Gates | 2000000 | |
| Number of Inputs | 333 | |
| Number of Logic Cells | 46080 | |
| Number of Outputs | 333 | |
| Number of Terminals | 456 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 5120 CLBS, 2000000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |
Alternate Parts for XC3S2000-4FGG456C
This table gives cross-reference parts and alternative options found for XC3S2000-4FGG456C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S2000-4FGG456C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XC3S2000-4FG456C | Field Programmable Gate Array, 5120 CLBs, 2000000 Gates, 630MHz, 46080-Cell, CMOS, PBGA456, 23 X 23 MM, FBGA-456 | AMD Xilinx | XC3S2000-4FGG456C vs XC3S2000-4FG456C |