Datasheets
XC6VLX550T-3FFG1760C by: AMD Xilinx

Field Programmable Gate Array,

Part Details for XC6VLX550T-3FFG1760C by AMD Xilinx

Overview of XC6VLX550T-3FFG1760C by AMD Xilinx

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Price & Stock for XC6VLX550T-3FFG1760C

Part # Distributor Description Stock Price Buy
MacroQuest Electronics ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018 7 Stock,5 Available
  • 1 $6,187.1600
  • 10 $5,748.0700
  • 25 $5,308.9800
  • 100 $4,869.8900
$4,869.8900 / $6,187.1600 Buy Now

Part Details for XC6VLX550T-3FFG1760C

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XC6VLX550T-3FFG1760C Part Data Attributes:

XC6VLX550T-3FFG1760C AMD Xilinx
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XC6VLX550T-3FFG1760C AMD Xilinx Field Programmable Gate Array,
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1760,42X42,40
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.59 ns
JESD-30 Code S-PBGA-B1760
JESD-609 Code e1
Length 42.5 mm
Moisture Sensitivity Level 4
Number of CLBs 42960
Number of Inputs 1200
Number of Logic Cells 549888
Number of Outputs 1200
Number of Terminals 1760
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 42960 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.5 mm
Supply Voltage-Max 1.05 V
Supply Voltage-Min 0.95 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 42.5 mm

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