Part Details for XCZU4CG-1FBVB900E by AMD Xilinx
Overview of XCZU4CG-1FBVB900E by AMD Xilinx
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Applications
Education and Research
Industrial Automation
Electronic Manufacturing
Price & Stock for XCZU4CG-1FBVB900E
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
66AH1398
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Newark | Soc, 1.2Ghz, Fcbga-900, Product Range:Zynq Family Ultrascale+ Series Microprocessors, Cpu Speed:1.2Ghz, Core Architecture:Arm Cortex-A53, Arm Cortex-R5F, Mpu Case Style:Fcbga, No. Of Pins:900Pins Rohs Compliant: Yes |Amd Xilinx XCZU4CG-1FBVB900E Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 4 |
|
$1,430.4200 | Buy Now |
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Bristol Electronics | 31 |
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RFQ | ||
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Quest Components | 32 |
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$853.5375 / $995.7938 | Buy Now | |
DISTI #
3381077
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element14 Asia-Pacific | MPU, ARM CORTEX-A53 / CORTEX-R5F, 1.2GHZ RoHS: Compliant Min Qty: 1 Container: Each | 4 |
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$1,466.6520 | Buy Now |
DISTI #
3381077
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Farnell | MPU, ARM CORTEX-A53 / CORTEX-R5F, 1.2GHZ RoHS: Compliant Min Qty: 1 Lead time: 17 Weeks, 1 Days Container: Each | 4 |
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$1,486.1695 | Buy Now |
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MacroQuest Electronics | FPGA Zynq UltraScale+ Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray - Trays | 560 |
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$1,045.2100 / $1,375.4000 | Buy Now |
Part Details for XCZU4CG-1FBVB900E
XCZU4CG-1FBVB900E CAD Models
XCZU4CG-1FBVB900E Part Data Attributes
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XCZU4CG-1FBVB900E
AMD Xilinx
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Datasheet
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XCZU4CG-1FBVB900E
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-900 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 52 Weeks | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 900 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |