Part Details for XCZU4CG-1FBVB900I by AMD Xilinx
Overview of XCZU4CG-1FBVB900I by AMD Xilinx
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Applications
Education and Research
Industrial Automation
Electronic Manufacturing
Price & Stock for XCZU4CG-1FBVB900I
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 3 |
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RFQ | ||
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MacroQuest Electronics | FPGA Zynq UltraScale+ Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray - Trays | 500 |
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$1,195.4800 / $1,566.5700 | Buy Now |
Part Details for XCZU4CG-1FBVB900I
XCZU4CG-1FBVB900I CAD Models
XCZU4CG-1FBVB900I Part Data Attributes
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XCZU4CG-1FBVB900I
AMD Xilinx
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Datasheet
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XCZU4CG-1FBVB900I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |