Part Details for XCZU5CG-L1FBVB900I by AMD Xilinx
Overview of XCZU5CG-L1FBVB900I by AMD Xilinx
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Price & Stock for XCZU5CG-L1FBVB900I
| Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | Zynq UltraScale+ FPGA Dual APU Mid Speed Flip-chip with 1 mm Ball Pitch 256200 Cells 1.5 GHz 900-Ball FCBGA Tray - Trays | 28 |
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$2,546.7200 / $2,882.7900 | Buy Now |
Part Details for XCZU5CG-L1FBVB900I
XCZU5CG-L1FBVB900I CAD Models
XCZU5CG-L1FBVB900I Part Data Attributes
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XCZU5CG-L1FBVB900I
AMD Xilinx
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Datasheet
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XCZU5CG-L1FBVB900I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage-Max | 0.742 V | |
| Supply Voltage-Min | 0.698 V | |
| Supply Voltage-Nom | 0.72 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |