Part Details for XCZU5EG-1FBVB900I by AMD Xilinx
Overview of XCZU5EG-1FBVB900I by AMD Xilinx
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Applications
Computing and Data Storage
Part Details for XCZU5EG-1FBVB900I
XCZU5EG-1FBVB900I CAD Models
XCZU5EG-1FBVB900I Part Data Attributes
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XCZU5EG-1FBVB900I
AMD Xilinx
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Datasheet
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XCZU5EG-1FBVB900I
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 52 Weeks | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Length | 31 mm | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 900 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 2.88 mm | |
Supply Voltage-Max | 0.876 V | |
Supply Voltage-Min | 0.825 V | |
Supply Voltage-Nom | 0.85 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 31 mm | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC |