Part Details for XCZU5EG-2FBVB900E by AMD Xilinx
Overview of XCZU5EG-2FBVB900E by AMD Xilinx
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Applications
Computing and Data Storage
Price & Stock for XCZU5EG-2FBVB900E
| Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | IC SOC CORTEX-A53 900FCBGA | 100 |
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$2,718.5600 / $3,046.6400 | Buy Now |
Part Details for XCZU5EG-2FBVB900E
XCZU5EG-2FBVB900E CAD Models
XCZU5EG-2FBVB900E Part Data Attributes
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XCZU5EG-2FBVB900E
AMD Xilinx
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Datasheet
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Compare Parts:
XCZU5EG-2FBVB900E
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FCBGA-900
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Date Of Intro | 2017-02-15 | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Length | 31 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 2.88 mm | |
| Supply Voltage-Max | 0.876 V | |
| Supply Voltage-Min | 0.825 V | |
| Supply Voltage-Nom | 0.85 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 31 mm | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC |