Part Details for XCZU7EV-3FBVB900E by AMD Xilinx
Overview of XCZU7EV-3FBVB900E by AMD Xilinx
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for XCZU7EV-3FBVB900E
XCZU7EV-3FBVB900E CAD Models
XCZU7EV-3FBVB900E Part Data Attributes
|
XCZU7EV-3FBVB900E
AMD Xilinx
Buy Now
Datasheet
|
Compare Parts:
XCZU7EV-3FBVB900E
AMD Xilinx
Microprocessor Circuit, CMOS, PBGA900, FLIPCHIP-900
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-900 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 52 Weeks | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 900 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Supply Voltage-Max | 0.927 V | |
Supply Voltage-Min | 0.873 V | |
Supply Voltage-Nom | 0.9 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |