Part Details for XPC850ZT66BU by Freescale Semiconductor
Overview of XPC850ZT66BU by Freescale Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for XPC850ZT66BU
XPC850ZT66BU CAD Models
XPC850ZT66BU Part Data Attributes
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XPC850ZT66BU
Freescale Semiconductor
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Datasheet
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XPC850ZT66BU
Freescale Semiconductor
32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 5A991 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 26 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 66 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
Length | 23 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 220 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.35 mm | |
Speed | 66 MHz | |
Supply Voltage-Max | 3.465 V | |
Supply Voltage-Min | 3.135 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 23 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for XPC850ZT66BU
This table gives cross-reference parts and alternative options found for XPC850ZT66BU. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC850ZT66BU, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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XPC850SRCZT66BU | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC | Freescale Semiconductor | XPC850ZT66BU vs XPC850SRCZT66BU |
XPC850ZT66BU | 32-BIT, 66 MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Motorola Mobility LLC | XPC850ZT66BU vs XPC850ZT66BU |
XPC850ZT66B | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Motorola Mobility LLC | XPC850ZT66BU vs XPC850ZT66B |
XPC850SRCZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Motorola Mobility LLC | XPC850ZT66BU vs XPC850SRCZT66BU |
XPC850SRZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 | Freescale Semiconductor | XPC850ZT66BU vs XPC850SRZT66BU |
XPC850DECZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 | Freescale Semiconductor | XPC850ZT66BU vs XPC850DECZT66BU |
XPC850CZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Motorola Mobility LLC | XPC850ZT66BU vs XPC850CZT66BU |
XPC850CZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 | Freescale Semiconductor | XPC850ZT66BU vs XPC850CZT66BU |
XPC850DEZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Motorola Mobility LLC | XPC850ZT66BU vs XPC850DEZT66BU |
XPC850DEZT66BU | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC | Freescale Semiconductor | XPC850ZT66BU vs XPC850DEZT66BU |